The Years of Engineering

F.E. Fond of Engineering
S.E. Sick Of Engineering
T.E. Tired of Engineering
B.E. balls to Engineering
Engineers Anthem:
Hum Honge All Clear,Honge AllC lear, Honge All Clear Ek Din, OH-HO, Mann me hai vishwas, pura hai vishwas, hum ho! ge all clear ek din

Top two Engineering Rumors:
'Did you hear the results are being put up today at 5:30pm'
'Did you hear the exams are postponed by two weeks, its been put up at VJTI'

The most dreaded acronym for Engineers:
ATKT ( After Trying Keep Trying)

The most important criteria while selecting an engi! neering college:
Girl to Boy ratio ( if more than0 .025% then that college is engineers dream come true)

Engineers at work:
Assignments solved by one and then carrying out mass transfer operations throughout the class

The most important machine for Engineers:
Xerox Machine (Without which assignment completion wouldn't be possible)

The most important table in an Engineer's House:
The glass table ( to carry out GT operations, during Night Duty.)

The only queue an Engineer is familiar with:
Submission Queue

An Engineer's favourite watch:
Bird Watch !

Common Engineering Dialogues after a paper:
'Wha! t is this yaar, more than 70% of the paper was out of the syllabus'
'This was the worst paper set in the entire engineering history'

An engineer's 10 engineering commandments of Life

1. Thou shalt study only during the preparatory leave.
2. Thou shalt never write thy assignments thyself.
3. Thou shalt begin writing thy journals only on the morning of submission.
4. Thou shalt treat all marks above 40 as bonus.
5. Thou shalt have at least 70 per cent attendance in the canteen.
6. Thou shalt pass GRACEfully.
7. Thou shalt always be an OUTstanding student.
8. Thou shalt give thy attendance without being present...PROXY is a MUST
9. If thou can't convince them , confuse them.
10. Thou shalt start every sentence with a four-lettered word.

The Truth about exams....

Irony : The guy who copied your entire paper passes and you flunk.

Critical Calculation : Summing up the marks you attempted worth in the exam...

Re-verification : A cruel joke. (results of which come after you give the KT exam).

Some Basic definitions..

Engineering College : Place where you're punished for getting good HSC marks.

Senior : Guy who got ragged as junior and wanna get some payback...

Fresher : Guy who has to ask where the canteen is...

Really Dumb Fresher : Guy who asks a senior where the canteen is.

Really Really Dumb fresher : Guy who follows the senior to the canteen.

Ragging : The unfortunate fate of the previous idiot.

Evasive action : Watch the juniors when any seniors come nearby. (No one runs faster than a fresher. NO ONE.)

Lectures : Waste of time. Physical presence is a must...only meant for sleeping, completing assignments & general TP

Tuitions : What you take when you don't waste enough time....

Professor : Perso! n paid to put students to sleep.

Vernacular Prof : Unusual variant of previous individual who comes packaged with his own brand of English ("Now you check me our journal." "You Out get from class." "Are you Understand, Beta?" )

Practicals : 60 to 90 minutes in which you watch the girls do your experiment, and usually destroy a considerable array of lab equipment.

Hopeless Practical : The practical in which there are no girls in your group simply look blankly at each other, fiddle with the equipment, and finally copy the readings.(from the girls of course...).

My Gujarat

A Wednesday...( Rephrased) for all the engineers...

All of you who have seen the movie ‘A Wednesday’... will love it...

Commissioner Rathore : kaun ho tum..??? kya pehcan hai tumhari ?

Unkonwn Caller : Kau hoon mein...mein vo hu jo aaj commintment karne se darta hai, Mein vo hoon jo aaj ghar jaane se darta ha, ye soch ke kahin ghar wale pehchanne se inkar na kar de...

mein vo hoon jo, aaj job change karta hai to sochta hai ki kahin recession mein mujhe company se na nikal de..

mein vo hoon jiski girlfriend usse friday ko dus bar phone karti hai, "kya kar rahe ho..?? kaam jyada hai..?? thak gaye ho..?? "
mera haal poochne ke liye ya kaam poochne ke liye nahi, rathore saab... balki vo ye jaanaa chahti hai ki... kahin hamesha ki tarah end moment pe
boss ke bulane pe mein satrudary ki date cancel to nahi kar raha...

mein vo hoon jo breakfast ke time pe dinner karta hai, lunch time pe breakfast karta hai, dinner ke time pe lunch karta hai.. vo bhi time mil jae to...

mein vo hoon jo aksar phasta hain
kabhi Interviews ke sawaal mey phasta hai , kabhi Badi companiyon ke jaal mey phasta hai, kabhi boss aur client ke bawaal mey fasta hai.

Software professionals ki bheed to dekhi hogi aapne rathore saab... us bheed mein se ko bhi chehra chun lijie.. mein vo hoon..

I'm the same old .. . SOFTWARE ENGINEER....

My Rajkot......Come & Enjoy It......

Technical Version of 3-idiots

GIVE ME SOME SUNSHINE(3idiots)

Saari umru hum

session main jee liye

Ek pal to ab humein coding do

coding do

Saari umru hum

session main jee liye

Ek pal to ab humein coding do

coding do

Na na na….Na na na….Na na na….Na na nana na….

Give me some project

Give me onsite

Give me another chance

I wanna code once again

Give me some project

Give me onsite

Give me another chance

I wanna code once again

Kandhon ko laptop

Ke bojh ne jhukaya

jhoot bolna tho khud

manager ne sikhaya

4.0 feebdback laaoge to ghadi, varna chhadi

Likh likh kar pada hatheli par

C,C++,java,.net ka chaala

courseware development ne poora..

Poora career jalaa daala

career to gaya

Jawani bhi gayi

Ek pal to ab humein

coding do coding do

career to gaya

Jawani bhi gayi

Ek pal to ab humein

coding do coding do

Saari umru hum

session main jee liye

Ek pal to ab humein coding do

coding do

Na na na….Na na na….Na na na….Na na nana na….

Give me some project

Give me onsite

Give me another chance

I wanna code once again

Give me some project

Give me onsite

Give me another chance

I wanna code once again

Na na na….Na na na….Na na na….Na na nana na….

Na na na….Na na na….Na na na….Na na nana na….

Network Security Videos

http://securitytube.net

Making of Intel Processor

Intel Shows How A PROCESSOR Is Made - Amazing process Sand. Made up of 25 percent silicon, is, after oxygen, the second most abundant chemical element that's in the earth's crust. Sand, especially quartz, has high percentages of silicon in the form of silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing. After procuring raw sand and separating the silicon, the excess material is disposed of and the silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called electronic grade silicon. The resulting purity is so great that electronic grade silicon may only have one alien atom for every one billion silicon atoms. After the purification process, the silicon enters the melting phase. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono-crystal is called an ingot. A mono-crystal ingot is produced from electronic grade silicon. One ingot weighs approximately 100 kilograms (or 220 pounds) and has a silicon purity of 99.9999 percent. The ingot is then moved onto the slicing phase where individual silicon discs, called wafers, are sliced thin. Some ingots can stand higher than five feet. Several different diameters of ingots exist depending on the required wafer size. Today, CPUs are commonly made on 300 mm wafers. Once cut, the wafers are polished until they have flawless, mirror-smooth surfaces. Intel doesn't produce its own ingots and wafers, and instead purchases manufacturing-ready wafers from third-party companies. Intel’s advanced 45 nm High-K/Metal Gate process uses wafers with a diameter of 300 mm (or 12-inches). When Intel first began making chips, it printed circuits on 50 mm (2-inches) wafers. These days, Intel uses 300 mm wafers, resulting in decreased costs per chip. The blue liquid, depicted above, is a photo resist finish similar to those used in film for photography. The wafer spins during this step to allow an evenly-distributed coating that's smooth and also very thin. At this stage, the photo-resistant finish is exposed to ultra violet (UV) light. The chemical reaction triggered by the UV light is similar to what happens to film material in a camera the moment you press the shutter button. Areas of the resist on the wafer that have been exposed to UV light will become soluble. The exposure is done using masks that act like stencils. When used with UV light, masks create the various circuit patterns. The building of a CPU essentially repeats this process over and over until multiple layers are stacked on top of each other. A lens (middle) reduces the mask's image to a small focal point. The resulting "print" on the wafer is typically four times smaller, linearly, than the mask's pattern. In the picture we have a representation of what a single transistor would appear like if we could see it with the naked eye. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that they claim roughly 30 million of them could fit on the head of a pin. After being exposed to UV light, the exposed blue photo resist areas are completely dissolved by a solvent. This reveals a pattern of photo resist made by the mask. The beginnings of transistors, interconnects, and other electrical contacts begin to grow from this point. The photo resist layer protects wafer material that should not be etched away. Areas that were exposed will be etched away with chemicals. After the etching, the photo resist is removed and the desired shape becomes visible. More photo resist (blue) is applied and then re-exposed to UV light. Exposed photo resist is then washed off again before the next step, which is called ion doping. This is the step where ion particles are exposed to the wafer, allowing the silicon to change its chemical properties in a way that allows the CPU to control the flow of electricity. Through a process called ion implantation (one form of a process called doping) the exposed areas of the silicon wafer are bombarded with ions. Ions are implanted in the silicon wafer to alter the way silicon in these areas conduct electricity. Ions are propelled onto the surface of the wafer at very high velocities. An electrical field accelerates the ions to a speed of over 300,000 km/hour (roughly 185,000 mph) After the ion implantation, the photo resist will be removed and the material that should have been doped (green) now has alien atoms implanted. This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. These three holes will be filled with copper, which will make up the connections to other transistors. The wafers are put into a copper sulphate solution at this stage. Copper ions are deposited onto the transistor through a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer. The copper ions settle as a thin layer on the wafer surface. The excess material is polished off leaving a very thin layer of copper. Multiple metal layers are created to interconnects (think wires) in between the various transistors. How these connections have to be “wired” is determined by the architecture and design teams that develop the functionality of the respective processor (for example, Intel’s Core i7 processor). While computer chips look extremely flat, they may actually have over 20 layers to form complex circuitry. If you look at a magnified view of a chip, you will see an intricate network of circuit lines and transistors that look like a futuristic, multi-layered highway system. This fraction of a ready wafer is being put through a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to "the right answer." After tests determine that the wafer has a good yield of functioning processor units, the wafer is cut into pieces (called dies). The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging). Bad dies are discarded. Several years ago, Intel made key chains out of bad CPU dies. This is an individual die, which has been cut out in the previous step (slicing). The die shown here is a die of an Intel Core i7 processor. The substrate, the die, and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be applied. This will keep the processor cool during operation. A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps and only the most important ones have been visualized in this picture story. During this final test the processors will be tested for their key characteristics (among the tested characteristics are power dissipation and maximum frequency). Based on the test result of class testing processors with the same capabilities are put into the same transporting trays. This process is called "binning". Binning determines the maximum operating frequency of a processor, and batches are divided and sold according to stable specifications. The manufactured and tested processors (again Intel Core i7 processor is shown here) either go to system manufacturers in trays or into retail stores in a box. Many thanks to Intel for supplying the text and photos in this picture story.

Amaizing Job

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